| PART |
Description |
Maker |
| 2-1445051-2 2-1445051-4 2-1445051-7 2-1445051-3 2- |
VERTICAL THRU HOLE HEADER ASSY, TIN CONTACTS, WITH THRU HOLE HOLDDOWNS, SINGLE ROW, MICRO MATE-N-LOK
VERTICAL THRU HOLE HEDER ASSY TIN CONTACTS WITH THRU HOLE HOLDDOWNS, SINGLE ROW, MICRO MATE-N-LOK
VERTCAL THRU HOLE HEADER ASSY, TIN CONTATS, WITH THRU HOLE HOLDDOWNS, SINGLE ROW, MICRO MATE-N-LOK
|
Tyco Electronics
|
| 43045-0213 43045-0214 43045-0212 430450212 43045-1 |
MICRO FIT (3.0) DUAL ROW VERTICAL THRU HOLE HEADER ASSY
|
Molex Electronics Ltd.
|
| MMB1901R480 MM-B1901-R480 36512-0196 0365120196 |
2.54mm (.100) Pitch DIN 41612 Header, Vertical, Through Hole, 0.4μm (16μ) Selective Gold (Au), 48 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Vertical, Through Hole, 0.4渭m (16渭") Selective Gold (Au), 48 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Vertical, Through Hole, 0.4楼矛m (16楼矛") Selective Gold (Au), 48 Circuits
|
Molex Electronics Ltd.
|
| 4-103240-0-03 4-103240-0-16 |
HEADER ASSY, MOD II, BREAKAWAY, DOUBLE ROW, .100X.100CL, VERTICAL, WITH .025 SQ POSTS
HEADER ASSY, MOD II, BREAKAWAY, DOUBLE ROW, .100X.100CL, VERTICAL,WITH .025 SQ POSTS
|
Tyco Electronics
|
| 87914-2216 0879142216 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 36511-0098 0365110098 MMB1501R963 MM-B1501-R963 |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, 0.60μm (24μ) Gold (Au) Plating, Tail Length 2.90mm (.114), 64 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, 0.60渭m (24渭") Gold (Au) Plating, Tail Length 2.90mm (.114"), 64 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, 0.60楼矛m (24楼矛") Gold (Au) Plating, Tail Length 2.90mm (.114"), 64 Circuits
|
Molex Electronics Ltd.
|
| 87891-2817 0878912817 |
2.54mm (.100 Header, Through Hole, Breakaway, Vertical, 28 Circuits 2.50渭m (100渭 Tape on Reel Packaging, Lead-free
2.54mm (.100 Header, Through Hole, Breakaway, Vertical, 28 Circuits 2.50μm (100μ Tape on Reel Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 15-80-0081 A-70567-0002 0015800081 705670002 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 36511-0122 0365110122 MMB1502R963 MM-B1502-R963 |
2.54mm (.100) Pitch DIN 41612 Header, Style R, Through Hole, Vertical, 0.60μm (24μ) Gold (Au) Plating, Tail Length 4.50mm (.177), 64 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Style R, Through Hole, Vertical, 0.60渭m (24渭") Gold (Au) Plating, Tail Length 4.50mm (.177"), 64 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Style R, Through Hole, Vertical, 0.60楼矛m (24楼矛") Gold (Au) Plating, Tail Length 4.50mm (.177"), 64 Circuits
|
Molex Electronics Ltd.
|
| 15-80-0089 0015800089 A-70567-0274 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0129 0015800129 A-70567-0276 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0283 0015800283 |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
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